Samsung releases more details about its 7nm and 10nm chip manufacturing processes

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Samsung has been making great strides in chip manufacturing technology. It was one of the
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for mobile devices, and now company has released more details about its upcoming 7nm and 10nm fabrication processes. It has also announced future roadmaps for the existing
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and 28nm processes.

Samsung claims that it fully intends to deploy extreme UV (EUV) to mass produce 7nm chips. This is significant since even experts were unsure about the necessity of EUV in the
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fabrication process. However, Samsung said that using EUV is imperative to keep production costs under check. That’s because the alternative, triple patterning process, is significantly more expensive than EUV.

On
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side of things, Samsung said that it would be an improvement over the existing 14nm process, in addition to providing improved performance and possibly reducing cost as well. The company recently announced that it will
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. The 10LPE (Low Power Early) process will be followed by 10LPP (Low Power Plus), which is expected to provide 10-percent performance improvement. More importantly, a chip design done in 10LPE could easily be ported to 10LPP process.

Samsung seems to be doing well with 14nm process with its fab plants in Korea and Texas running at full steam, shipping 0.5 million wafers to date. The plant is currently taking orders from
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and
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based on the company’s second generation 14nm FinFET process.

The company is doing great on the foundry side while being aggressive on the R&D front, but it needs to be seen whether its processes are as good as Intel’s or TSMC’s. A recent study showed that Apple’s A9 chipsets manufactured by TSMC’s 16nm process had
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.

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