Samsung, the world’s biggest memory chip maker, has that it has developed the world’s first HBM (high-bandwidth memory) chip with integrated AI processing. The new chip not only improves AI processing performance but also lowers power consumption. The company has named the new memory chip HBM-PIN where PIN stands for ‘processing in memory’.
The South Korean firm’s , was used to develop the new HBM-PIN memory. The PIN part features advanced logic-based processing units, and it more than doubles the AI processing performance and reduces power consumption by 70%. The new memory chip from Samsung will mostly be used in high-performance computing servers and AI applications.
In the standard computer architecture, memory and processing are kept separate, which increases the latency when a lot of data is moved between them. To overcome those latency issues, Samsung created HBM-PIN. The new chip is also compatible with the previous-generation HBM interface, which means companies can set up AI accelerators without changing existing hardware and software.
Samsung mentioned in a press release that it will supply HBM-PIN chips to customers for testing and verification in the first half of 2021, and then work with clients to standardize the PIM platform across the ecosystem.
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The South Korean firm’s , was used to develop the new HBM-PIN memory. The PIN part features advanced logic-based processing units, and it more than doubles the AI processing performance and reduces power consumption by 70%. The new memory chip from Samsung will mostly be used in high-performance computing servers and AI applications.
In the standard computer architecture, memory and processing are kept separate, which increases the latency when a lot of data is moved between them. To overcome those latency issues, Samsung created HBM-PIN. The new chip is also compatible with the previous-generation HBM interface, which means companies can set up AI accelerators without changing existing hardware and software.
Samsung mentioned in a press release that it will supply HBM-PIN chips to customers for testing and verification in the first half of 2021, and then work with clients to standardize the PIM platform across the ecosystem.
The post appeared first on .