has the world's thinnest LPDDR5X chip, which is just 0.65mm thin, or as thin as a fingernail. This chip is made for high-end smartphones, which typically have an onboard neural processing unit (NPU) for on-device AI processing.
The newest LPDDR5X DRAM chip from Samsung is the world's thinnest 12nm-class chip. It is available in 12GB and 16GB capacities. This chip is made using four stacked layers, each containing two LPDDR DRAM chips. Due to its thin profile, it offers more space in mobile devices, allowing for a better thermal design. According to Samsung, its new memory chip improves heat resistance by up to 21.2% compared to the previous-generation LPDDR5X chip.
Samsung optimized the printed circuit board (PCB), epoxy molding compound (EMC), and the back-lapping process to minimize the chip's height. The company plans to start supplying its new chip to smartphone manufacturers soon. It also announced that it will soon start making 24GB (6-layer) and 32GB (8-layer) LPDDR DRAM chips for future mobile devices.
YongCheol Bae, the Executive VP of Samsung's Memory Product Planning team, said, “Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
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Samsung's newest LPDDR5X DRAM is just 0.65mm thin, making it the world's thinnest in its segment
The newest LPDDR5X DRAM chip from Samsung is the world's thinnest 12nm-class chip. It is available in 12GB and 16GB capacities. This chip is made using four stacked layers, each containing two LPDDR DRAM chips. Due to its thin profile, it offers more space in mobile devices, allowing for a better thermal design. According to Samsung, its new memory chip improves heat resistance by up to 21.2% compared to the previous-generation LPDDR5X chip.
Samsung optimized the printed circuit board (PCB), epoxy molding compound (EMC), and the back-lapping process to minimize the chip's height. The company plans to start supplying its new chip to smartphone manufacturers soon. It also announced that it will soon start making 24GB (6-layer) and 32GB (8-layer) LPDDR DRAM chips for future mobile devices.
YongCheol Bae, the Executive VP of Samsung's Memory Product Planning team, said, “Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
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