On Monday, announced two new chips, the IBM Telum II Processor and the IBM Spyre Accelerator. As the name suggests, the former is a CPU and it comes as a successor to the IBM Telum that the company launched in 2021. The latter is a chip that can provide additional AI computing capability to the Telum II processor. Both of them are designed to power the next-generation IBM Z mainframe systems.
In the , IBM revealed that it will get the IBM Telum II as well as the IBM Spyre Accelerator manufactured by and built on its “high performance, power efficient process node.” The company also referred to the South Korean tech giant as “IBM's long-standing fabrication partner.”
The story continues after the video…
According to IBM, the Telum II offers “increased frequency, memory capacity, a 40 percent growth in cache and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first generation Telum chip.”
As for the IBM Spyre Accelerator, IBM says “Working together, the Telum II and Spyre chips form a scalable architecture to support ensemble methods of AI modeling – the practice of combining multiple machine learning or deep learning AI models with encoder LLMs. By leveraging the strengths of each model architecture, ensemble AI may provide more accurate and robust results compared to individual models.”
IBM plans to make the two new chips available in 2025.
The post appeared first on .
In the , IBM revealed that it will get the IBM Telum II as well as the IBM Spyre Accelerator manufactured by and built on its “high performance, power efficient process node.” The company also referred to the South Korean tech giant as “IBM's long-standing fabrication partner.”
The story continues after the video…
IBM Telum II Processor and IBM Spyre Accelerator highlights
According to IBM, the Telum II offers “increased frequency, memory capacity, a 40 percent growth in cache and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first generation Telum chip.”
As for the IBM Spyre Accelerator, IBM says “Working together, the Telum II and Spyre chips form a scalable architecture to support ensemble methods of AI modeling – the practice of combining multiple machine learning or deep learning AI models with encoder LLMs. By leveraging the strengths of each model architecture, ensemble AI may provide more accurate and robust results compared to individual models.”
IBM plans to make the two new chips available in 2025.
The post appeared first on .